Advanced Package Development Engineer
Apple
Marketing & Communications, Product
San Francisco, CA, USA · Oregon, USA · San Francisco Bay Area, CA, USA · Multiple locations
USD 181,100-318,400 / year + Equity
Posted on Feb 5, 2026
Join the team behind the technology in a billion pockets worldwide. Apple's Advanced Packaging Program is seeking engineers to drive package integration and technology development for next-generation products. In this role, you'll contribute to the advanced packaging technologies that enable Apple's industry-leading silicon performance. You'll work alongside world-class engineers to solve complex integration challenges and bring new packaging innovations from concept to mass production.
Developing advanced packaging technologies in a cross-functional team. You will be responsible for Package integration and technology development. We're looking for someone who: • Has deep expertise in semiconductor packaging or related disciplines • Thrives on solving difficult technical problems • Holds themselves to a high standard of engineering excellence • Is self-motivated and comfortable navigating ambiguity
- Develop and qualify advanced packaging technologies including substrate design, interconnect architectures, and assembly processes to meet performance, power, and form factor requirements for next-generation products.
- Drive package integration across silicon, firmware, and system teams to ensure co-optimization of die architecture, package design, and thermal/mechanical constraints.
- Lead characterization and failure analysis efforts to identify root causes of reliability or performance issues and implement corrective actions.
- Partner with external suppliers and foundries to evaluate new materials and processes, establish specifications, and enable technology transfer to high-volume manufacturing.
- Define and execute test vehicles and experiments to validate packaging concepts, establish design rules, and generate data for product design decisions.
- BS and 10+ years of experience in relevant industry experience.
- PhD and 6+ years of experience in relevant industry preferred.
- Silicon fab interconnect process integration experience in BEoL process, RDL, fine pitch μ-bumps, hybrid bonds, TSVs, etc.
- Deep knowledge of electrical, mechanical and thermal properties of fab materials.
- Strong expertise in Si Fab equipment and Fab Logistics Management.
- Experience on advanced packaging for groundbreaking CMOS nodes.
- Expertise on Si structure yield and reliability mechanisms and analyses.
- Good familiarity with electrical, mechanical and/or thermal characterization, failure analysis.
- Tool experience: One or more of TCAD, JMP, Virtuoso, KLayout, Ansys EDT.
- Capable of independent R&D Work in a cross-functional team, driving vendors.
- Excellent communication skills.
- Experience in Si fab integration role and advanced packaging.
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