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Senior Software Engineer - Backend Platform

Location: Ra'anana, Israel
Posted:
Today
Senior
Cables
Communications Equipment
Connectivity
Connectivity Products
Electronic Equipment and Instruments
Ethernet
Hardware
Infrastructure
Low Latency
Networking
Routers & Switches
Science and Engineering
Semiconductors
Semiconductors & Related Devices
Software
Technology
Technology and Computing

Sr. Signal & Power Integrity Engineer, Annapurna Labs - AI Silicon Packaging

Location: Austin, TX, USA
Posted:
3 days
IPO
Senior
Consumer Goods
E-Commerce
Retail
Shopping

Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging

Location: Tempe, AZ, USA
Posted:
7 days
Mid-Senior Level
Consumer Goods
E-Commerce
Retail
Shopping

Senior Packaging Technical Engineer - Hardware

Location: Hsinchu City, Taiwan 300
Posted:
25 days
Senior
Cables
Communications Equipment
Connectivity
Connectivity Products
Electronic Equipment and Instruments
Ethernet
Hardware
Infrastructure
Low Latency
Networking
Routers & Switches
Science and Engineering
Semiconductors
Semiconductors & Related Devices
Software
Technology
Technology and Computing

Senior Packaging Technical Engineer - Hardware

Location: Bengaluru, Karnataka, India
Posted:
1 month
Senior
Cables
Communications Equipment
Connectivity
Connectivity Products
Electronic Equipment and Instruments
Ethernet
Hardware
Infrastructure
Low Latency
Networking
Routers & Switches
Science and Engineering
Semiconductors
Semiconductors & Related Devices
Software
Technology
Technology and Computing

Senior IC Packaging Development Engineer

Location: Santa Clara, CA, USA
Compensation:

USD 168k-345k / year + Equity

Posted:
2 months
Senior
Cables
Communications Equipment
Connectivity
Connectivity Products
Electronic Equipment and Instruments
Ethernet
Hardware
Infrastructure
Low Latency
Networking
Routers & Switches
Science and Engineering
Semiconductors
Semiconductors & Related Devices
Software
Technology
Technology and Computing

Senior OSAT Manufacturing Development Engineer

Location: hsinchu, east district, hsinchu city, taiwan
Posted:
2 months
Senior
Cables
Communications Equipment
Connectivity
Connectivity Products
Electronic Equipment and Instruments
Ethernet
Hardware
Infrastructure
Low Latency
Networking
Routers & Switches
Science and Engineering
Semiconductors
Semiconductors & Related Devices
Software
Technology
Technology and Computing

Sr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging

Location: Tempe, AZ, USA
Posted:
2 months
Senior
Consumer Goods
E-Commerce
Retail
Shopping

Senior Signal Integrity Engineer - LPU Packaging

Location: Santa Clara, CA, USA
Compensation:

USD 168k-310,500 / year + Equity

Posted:
3 months
Senior
Cables
Communications Equipment
Connectivity
Connectivity Products
Electronic Equipment and Instruments
Ethernet
Hardware
Infrastructure
Low Latency
Networking
Routers & Switches
Science and Engineering
Semiconductors
Semiconductors & Related Devices
Software
Technology
Technology and Computing

Principal Signal and Power Integrity Engineer

Location: Mountain View, CA, USA; Redmond, WA, USA
Compensation:

USD 142,800-274,800 / year

Posted:
3 months
ICO
Senior
Artificial Intelligence (AI)
Data Management
Developer Tools
DevOps
Enterprise Software
Operating Systems
Software

IC Package Design Engineer

Location: San Francisco, CA, USA; Oregon, USA; San Francisco Bay Area, CA, USA; Multiple locations
Compensation:

USD 181,100-318,400 / year + Equity

Posted:
4 months
Senior
Consumer Electronics
Consumer Products, Hardware
Hardware
Mobile Devices
Operating Systems
Wearables

IC Package Design Engineer

Location: Oregon, USA; Austin, TX, USA; Metro Manila, Philippines; Los Angeles, CA, USA; Multiple locations
Compensation:

USD 171,600-302,200 / year + Equity

Posted:
4 months
Senior
Consumer Electronics
Consumer Products, Hardware
Hardware
Mobile Devices
Operating Systems
Wearables

IC Package Design Engineer

Location: Austin, TX, USA
Posted:
4 months
Senior
Consumer Electronics
Consumer Products, Hardware
Hardware
Mobile Devices
Operating Systems
Wearables

IC Package Design Engineer

Location: Austin, TX, USA
Posted:
4 months
Mid-Senior Level
Consumer Electronics
Consumer Products, Hardware
Hardware
Mobile Devices
Operating Systems
Wearables

IC Package Design Engineer

Location: San Francisco, CA, USA; Oregon, USA; San Francisco Bay Area, CA, USA; Multiple locations
Compensation:

USD 126,800-220,900 / year + Equity

Posted:
4 months
Mid-Senior Level
Consumer Electronics
Consumer Products, Hardware
Hardware
Mobile Devices
Operating Systems
Wearables

IC Package Design Engineer

Location: Oregon, USA; Austin, TX, USA; Metro Manila, Philippines; Los Angeles, CA, USA; Multiple locations
Compensation:

USD 120,300-210,100 / year + Equity

Posted:
4 months
Mid-Senior Level
Consumer Electronics
Consumer Products, Hardware
Hardware
Mobile Devices
Operating Systems
Wearables

IC Packaging Engineer

Location: Yokne'am Illit, Israel
Posted:
5 months
Mid-Senior Level
Cables
Communications Equipment
Connectivity
Connectivity Products
Electronic Equipment and Instruments
Ethernet
Hardware
Infrastructure
Low Latency
Networking
Routers & Switches
Science and Engineering
Semiconductors
Semiconductors & Related Devices
Software
Technology
Technology and Computing

Packaging Substrate Engineer

Location: Austin, TX, USA
Posted:
6 months
Senior
Consumer Electronics
Consumer Products, Hardware
Hardware
Mobile Devices
Operating Systems
Wearables

IC Packaging Integration Engineer

Location: Austin, TX, USA
Posted:
6 months
Senior
Apps
Artificial Intelligence (AI)
Broadcasting
Consumer Electronics
Digital Entertainment
Foundational AI
Hardware
Media and Entertainment
Mobile Devices
Operating Systems
TV
Wearables

Packaging Assembly Engineer

Location: Austin, TX, USA
Posted:
6 months
Senior
Consumer Electronics
Consumer Products, Hardware
Hardware
Mobile Devices
Operating Systems
Wearables