SiP DFM Process Engineer
Apple
This job is no longer accepting applications
See open jobs at Apple.See open jobs similar to "SiP DFM Process Engineer" AnitaB.org.Cupertino, CA, USA
USD 195,500-293,800 / year + Equity
Posted on Jan 10, 2025
Summary
Posted:
Weekly Hours: 40
Role Number:200586141
Imagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. The people here at Apple don’t just create products — they create the kind of wonder that’s revolutionized entire industries. It’s the diversity of those people and their ideas that inspires the innovation that runs through everything we do, from amazing technology to industry-leading environmental efforts. We are seeking an experienced professional with expertise in the area of semiconductor packaging processes. This engineer will assist in the development of assembly and packaging process for SiP (System-in-package) modules and MLBs. The successful engineer in this role will be able to work at contract manufacturer sites, interacting closely with suppliers to deliver scalable manufacturing processes in a timely manner.
Description
Work with external contract manufacturers and Apple engineers to develop SMT, molding and saw processes/solutions collaborating closely with suppliers for semiconductor packaging equipment and material vendors. Provide engineering support for product builds at the factory, do data analysis and FA, report build status. Conduct factory audit, monitor and drive closure of any yield and reliability issues with factory. Work with Operations group and the extended supply chain to address production ramp and MP needs.
Minimum Qualifications
- 7+ years experience with SMT (surface mounting technology), underfill, molding, dicing saw, all in the context of high-volume semiconductor/packaging/electronics manufacturing.
- B.S in Materials Science, Chemical Engineering, Physics, Mechanical Engineering, or related fields
Key Qualifications
Preferred Qualifications
- Prior experience with development and qualification of semiconductor packages a plus
- Good understanding and skill for material characterizations, semiconductor packaging, component failure analysis, design for experiments, and data analysis.
- Ability to work with a wide range of people with varying degrees of experience.
- Excellent communication skills.
Education & Experience
Additional Requirements
Pay & Benefits
Apple is an equal opportunity employer that is committed to inclusion and diversity. We take affirmative action to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant.
This job is no longer accepting applications
See open jobs at Apple.See open jobs similar to "SiP DFM Process Engineer" AnitaB.org.