Silicon Photonics Design & Packaging Engineer
Apple
Design
Santa Clara, CA, USA
Posted on Jun 12, 2025
Silicon photonics (SiPh) technology is essential for realizing next-generation optical interconnects already implemented in data center connectivity and ready to penetrating into short distance within the boards. One critical technology to implement high-volume, low-cost SiPh optical interconnect is the development of high efficient optical I/O device/engine/module architecture, assembly, optical coupling design and process for single-mode fiber packaging. We are looking for a hardworking and passionate Si photonics device, photonic IC design & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics PIC/engine/chiplet packaging and co-packaging solutions utilizing advanced packaging technologies, define assembly baseline processes, decide package BOM, establish optical coupling design/manufacturing that are optimized for performance, reliability, yield and cost.