Assembly Process Integration Engineer
Apple
Santa Clara, CA, USA
USD 141,800-258,600 / year + Equity
Posted on Dec 18, 2025
At Apple, we believe new ideas have a way of becoming outstanding products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish!
The process Integration group is looking for a motivated process engineer who is committed to the integration and qualification of multi-stack thin films into a functional device. You will be responsible for developing and maturing process workflows, establishing critical to quality metrics, and using statistical process control on our journey to release this technology in an Apple product.
- Develop, evaluate, and improve microelectronic laser, interconnect, stacking, and packaging processes.
- Drive process readiness activities and prepare for transfer to manufacturing.
- Implement procedures to inspect, test, and evaluate reliability of equipment, process, and products.
- Establish SPC systems and maintain data collection and performance measurements to track performance consistency.
- Connect with multi-functional groups on schedules, metrics, and risk mitigation to facilitate process advancement.
- Collaborate with vendors to assess specifications, purchase of equipment, and evaluate products against quality standards.
- Define integrated device critical to quality metrics and implement solutions that achieve repeatability and reproducibility targets.
- BS degree.
- Experience in Thin Film Display, Solar, Optical Coatings, Semiconductor, or equivalent technology.
- Experience in thin-films development or process integration such as in assembly, stacking, automation, or packaging.
- Travel to suppliers and manufacturing facilities expected < 20%.
- MS with 5+ years of proven experience in Semiconductor, Thin Film Display, Solar, Optical Coating industries or an equivalent technology.
- Advanced technical knowledge of laser systems and automation equipment pertaining to optics, machine vision, and stacking in a semi-conductor background.
- Demonstrated ability to work with multi-functional teams to implement solutions that enabled new capabilities, productivity, quality, or solved a technical challenge.
- Lead engineering projects to scale such as in technology transfer to pilot lines or high volume manufacturing.
- Ability to set up, program/teach, troubleshoot, debug, and maintain assembly robot systems.
- Practical experience in statistical analysis and formal problem solving tools (SPC, GR&R, DOE, ANOVA, Fishbone diagrams, FMEA, RCA, FTA, etc.).
- Understanding and/or experience with characterization and FA techniques (FTIR, Optical Profilometry, Microscopy, SEM, TEM, XPS, XRD, Micro CT imaging).
- Demonstrated use of AI/ML tools to improve process efficiency and uncover data-driven insights for performance optimization.
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