Package Manufacture Engineer, up to Staff (Taichung or Kaohsiung )
Qualcomm
This job is no longer accepting applications
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Kaohsiung City, Taiwan
Posted on Apr 14, 2025
Company:
Qualcomm Semiconductor Limited
Job Area:
Engineering Group, Engineering Group > Hardware Engineering
General Summary:
As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.
Minimum Qualifications:
Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.
OR
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
10+ year experience in any of the following: Semiconductor (Packaging) Engineering or Manufacturing.
Preferred Master's degree in Electrical Engineering, Physics, Materials Science, or related discipline. Good Bachelor candidate with wide spectrum may be considered as well.
Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
If you would like more information about this role, please contact Qualcomm Careers.
3073520
Qualcomm Semiconductor Limited
Job Area:
Engineering Group, Engineering Group > Hardware Engineering
General Summary:
As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.
Minimum Qualifications:
- Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.
Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.
OR
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
- Exhibit skill and confidence in working cross-functionally across a matrix organization in a very dynamic and fast-paced environment.
- Support development of products and advanced technologies for Qualcomm bumping, WLP, Flip Chip CSP& BGA , SiP module and 2.5/3D Chiplet applications.
- Support product material and design selections, technical risk assessments, mitigation plans, and development from concept to production.
- Candidate will develop a strong understanding of substrate and assembly process details, SPC, Control plans, OCAPs, FMEAs, PCN, CARs.
- Candidate will work cross-functionally with Design, Device process development, internal and subcontract Packaging groups.
10+ year experience in any of the following: Semiconductor (Packaging) Engineering or Manufacturing.
- Deep understanding of packaging requirements, process capability and equipment capability throughout the industry and the ability to incorporate best engineering practices for all backend assembly process included automotive products requirements
- Familiar with excel, JMP data analysis tool.
- Basic knowledge of excel VBA, Tableau software.
- Good understanding of Chip level and package level reliability and failure analysis methodology.
- Understand yield management, continuous improvement, assembly cycle time analysis and cost reduction.
- Fluent in English and Mandarin, both spoken and written.
- Proactive working attitude and capable to handle new challenge.
- Good knowledge of quality concept and RMA process.
- Basic knowledge of foundry process.
- Good understanding of wafer bumping, laser grooving, wafer saw, Pick and place, underfill and Heat spread processes.
- Good experience with yield management software (O+), JMP analysis tool.
- Understand assembly and test house working model, turnkey model, supply chain and KPI.
Preferred Master's degree in Electrical Engineering, Physics, Materials Science, or related discipline. Good Bachelor candidate with wide spectrum may be considered as well.
Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
If you would like more information about this role, please contact Qualcomm Careers.
3073520
This job is no longer accepting applications
See open jobs at Qualcomm.See open jobs similar to "Package Manufacture Engineer, up to Staff (Taichung or Kaohsiung )" AnitaB.org.