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IC Packaging Engineer - WLP

Location: San Francisco, CA, USA; New York, USA; San Francisco Bay Area, CA, USA; Multiple locations
Compensation:

USD 129,300-225,300 / year + Equity

Posted:
1 month
Mid-Senior Level
Apps
Artificial Intelligence (AI)
Broadcasting
Consumer Electronics
Digital Entertainment
Foundational AI
Hardware
Media & Entertainment
Mobile Devices
Operating Systems
TV
Wearables

IC Packaging Engineer - WLP

Location: San Francisco, CA, USA; New York, USA; San Francisco Bay Area, CA, USA; Multiple locations
Compensation:

USD 184,700-324,800 / year + Equity

Posted:
1 month
Senior
Apps
Artificial Intelligence (AI)
Broadcasting
Consumer Electronics
Digital Entertainment
Foundational AI
Hardware
Media & Entertainment
Mobile Devices
Operating Systems
TV
Wearables

Packaging Engineer

Location: San Francisco, CA, USA; Ontario, Canada; New York, USA; San Francisco Bay Area, CA, USA; Multiple locations
Compensation:

USD 184,700-324,800 / year + Equity

Posted:
1 day
Senior
Apps
Artificial Intelligence (AI)
Broadcasting
Consumer Electronics
Digital Entertainment
Hardware
Mobile Devices
Operating Systems
TV
Wearables