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Showing 13 jobs

IC Packaging Integration Engineer

Location: San Francisco, CA, USA; New York, USA; San Francisco Bay Area, CA, USA; Multiple locations
Compensation:

USD 184,700-324,800 / year + Equity

Posted:
4 days
Senior
Apps
Artificial Intelligence (AI)
Broadcasting
Consumer Electronics
Digital Entertainment
Foundational AI
Hardware
Media & Entertainment
Mobile Devices
Operating Systems
TV
Wearables

Robotics System Integration & Deployment Engineer II, Robotics Delivery & Packaging Innovation

Location: Berlin, Germany
Posted:
1 month
Mid-Senior Level
Consumer Goods
E-Commerce
Retail
Shopping

Senior Thermal Engineer

Location: Santa Clara, CA, USA
Compensation:

USD 168k-310,500 / year + Equity

Posted:
18 days
Pre Seed
Senior
AI Infrastructure
Artificial Intelligence (AI)
Cloud Computing
Foundational AI
GPU
Hardware
Software
Virtual Reality

Senior Silicon Test Engineer, ATE

Location: New Taipei City, Taiwan
Posted:
20 days
Senior
Apps
Artificial Intelligence (AI)
Cloud Computing
Cloud Storage
Consumer
Machine Learning
Mobile Devices
Productivity Tools
Search Engine
SEO
Software Engineering

IC Package Design Engineer

Location: San Francisco, CA, USA; Oregon, USA; San Francisco Bay Area, CA, USA; Multiple locations
Compensation:

USD 181,100-318,400 / year + Equity

Posted:
3 months
Senior
Consumer Electronics
Consumer Products, Hardware
Hardware
Mobile Devices
Operating Systems
Wearables

IC Package Design Engineer

Location: Oregon, USA; Austin, TX, USA; Metro Manila, Philippines; Los Angeles, CA, USA; Multiple locations
Compensation:

USD 171,600-302,200 / year + Equity

Posted:
3 months
Senior
Consumer Electronics
Consumer Products, Hardware
Hardware
Mobile Devices
Operating Systems
Wearables

IC Package Design Engineer

Location: Austin, TX, USA
Posted:
3 months
Senior
Consumer Electronics
Consumer Products, Hardware
Hardware
Mobile Devices
Operating Systems
Wearables

IC Package Design Engineer

Location: Austin, TX, USA
Posted:
3 months
Mid-Senior Level
Consumer Electronics
Consumer Products, Hardware
Hardware
Mobile Devices
Operating Systems
Wearables

IC Package Design Engineer

Location: San Francisco, CA, USA; Oregon, USA; San Francisco Bay Area, CA, USA; Multiple locations
Compensation:

USD 126,800-220,900 / year + Equity

Posted:
3 months
Mid-Senior Level
Consumer Electronics
Consumer Products, Hardware
Hardware
Mobile Devices
Operating Systems
Wearables

IC Package Design Engineer

Location: Oregon, USA; Austin, TX, USA; Metro Manila, Philippines; Los Angeles, CA, USA; Multiple locations
Compensation:

USD 120,300-210,100 / year + Equity

Posted:
3 months
Mid-Senior Level
Consumer Electronics
Consumer Products, Hardware
Hardware
Mobile Devices
Operating Systems
Wearables

IC Packaging Integration Engineer

Location: Austin, TX, USA
Posted:
4 months
Senior
Apps
Artificial Intelligence (AI)
Broadcasting
Consumer Electronics
Digital Entertainment
Foundational AI
Hardware
Media and Entertainment
Mobile Devices
Operating Systems
TV
Wearables

Packaging Assembly Engineer

Location: Austin, TX, USA
Posted:
4 months
Senior
Consumer Electronics
Consumer Products, Hardware
Hardware
Mobile Devices
Operating Systems
Wearables

IC Packaging Integration Engineer

Location: Santa Clara, CA, USA
Compensation:

USD 181,100-318,400 / year + Equity

Posted:
6+ months
Senior
Apps
Artificial Intelligence (AI)
Broadcasting
Consumer Electronics
Digital Entertainment
Foundational AI
Hardware
Media and Entertainment
Mobile Devices
Operating Systems
TV
Wearables