On-site & Remote

Showing 19 jobs

Senior Packaging Technical Engineer - Hardware

Location: Hsinchu City, Taiwan 300
Posted:
11 days
Senior
Cables
Communications Equipment
Connectivity
Connectivity Products
Electronic Equipment and Instruments
Ethernet
Hardware
Infrastructure
Low Latency
Networking
Routers & Switches
Science and Engineering
Semiconductors
Semiconductors & Related Devices
Software
Technology
Technology and Computing

Senior Packaging Technical Engineer - Hardware

Location: Bengaluru, Karnataka, India
Posted:
25 days
Pre Seed
Senior
AI Infrastructure
Artificial Intelligence (AI)
Cloud Computing
Foundational AI
GPU
Hardware
Software
Virtual Reality

Senior IC Packaging Development Engineer

Location: Santa Clara, CA, USA
Compensation:

USD 168k-345k / year + Equity

Posted:
1 month
Pre Seed
Senior
AI Infrastructure
Artificial Intelligence (AI)
Cloud Computing
Foundational AI
GPU
Hardware
Software
Virtual Reality

Senior OSAT Manufacturing Development Engineer

Location: hsinchu, east district, hsinchu city, taiwan
Posted:
1 month
Pre Seed
Senior
AI Infrastructure
Artificial Intelligence (AI)
Cloud Computing
Foundational AI
GPU
Hardware
Software
Virtual Reality

Principal Signal and Power Integrity Engineer

Location: Mountain View, CA, USA; Redmond, WA, USA
Compensation:

USD 142,800-274,800 / year

Posted:
3 months
Senior
Artificial Intelligence (AI)
Data Management
Developer Tools
DevOps
Enterprise Software
Operating Systems
Software

IC Package Design Engineer

Location: San Francisco, CA, USA; Oregon, USA; San Francisco Bay Area, CA, USA; Multiple locations
Compensation:

USD 181,100-318,400 / year + Equity

Posted:
4 months
Senior
Consumer Electronics
Consumer Products, Hardware
Hardware
Mobile Devices
Operating Systems
Wearables

IC Package Design Engineer

Location: Oregon, USA; Austin, TX, USA; Metro Manila, Philippines; Los Angeles, CA, USA; Multiple locations
Compensation:

USD 171,600-302,200 / year + Equity

Posted:
4 months
Senior
Consumer Electronics
Consumer Products, Hardware
Hardware
Mobile Devices
Operating Systems
Wearables

IC Package Design Engineer

Location: Austin, TX, USA
Posted:
4 months
Senior
Consumer Electronics
Consumer Products, Hardware
Hardware
Mobile Devices
Operating Systems
Wearables

IC Package Design Engineer

Location: Austin, TX, USA
Posted:
4 months
Mid-Senior Level
Consumer Electronics
Consumer Products, Hardware
Hardware
Mobile Devices
Operating Systems
Wearables

IC Package Design Engineer

Location: San Francisco, CA, USA; Oregon, USA; San Francisco Bay Area, CA, USA; Multiple locations
Compensation:

USD 126,800-220,900 / year + Equity

Posted:
4 months
Mid-Senior Level
Consumer Electronics
Consumer Products, Hardware
Hardware
Mobile Devices
Operating Systems
Wearables

IC Package Design Engineer

Location: Oregon, USA; Austin, TX, USA; Metro Manila, Philippines; Los Angeles, CA, USA; Multiple locations
Compensation:

USD 120,300-210,100 / year + Equity

Posted:
4 months
Mid-Senior Level
Consumer Electronics
Consumer Products, Hardware
Hardware
Mobile Devices
Operating Systems
Wearables

Senior Packaging Technical Engineer - Hardware

Location: Bengaluru, Karnataka, India
Posted:
4 months
Pre Seed
Senior
AI Infrastructure
Artificial Intelligence (AI)
Cloud Computing
Foundational AI
GPU
Hardware
Software
Virtual Reality

IC Packaging Engineer

Location: Yokne'am Illit, Israel
Posted:
5 months
Pre Seed
Mid-Senior Level
AI Infrastructure
Artificial Intelligence (AI)
Cloud Computing
Foundational AI
GPU
Hardware
Software
Virtual Reality

Packaging Substrate Engineer

Location: Austin, TX, USA
Posted:
5 months
Senior
Consumer Electronics
Consumer Products, Hardware
Hardware
Mobile Devices
Operating Systems
Wearables

IC Packaging Integration Engineer

Location: Austin, TX, USA
Posted:
5 months
Senior
Apps
Artificial Intelligence (AI)
Broadcasting
Consumer Electronics
Digital Entertainment
Foundational AI
Hardware
Media and Entertainment
Mobile Devices
Operating Systems
TV
Wearables

Packaging Assembly Engineer

Location: Austin, TX, USA
Posted:
5 months
Senior
Consumer Electronics
Consumer Products, Hardware
Hardware
Mobile Devices
Operating Systems
Wearables

Senior Packaging Technical Engineer - Hardware

Location: Bengaluru, Karnataka, India
Posted:
7 months
Pre Seed
Senior
AI Infrastructure
Artificial Intelligence (AI)
Cloud Computing
Foundational AI
GPU
Hardware
Software
Virtual Reality

IC Packaging Integration Engineer

Location: Santa Clara, CA, USA
Compensation:

USD 181,100-318,400 / year + Equity

Posted:
6+ months
Senior
Apps
Artificial Intelligence (AI)
Broadcasting
Consumer Electronics
Digital Entertainment
Foundational AI
Hardware
Media and Entertainment
Mobile Devices
Operating Systems
TV
Wearables

Packaging Substrate Engineer

Location: San Francisco, CA, USA; Oregon, USA; San Francisco Bay Area, CA, USA; Multiple locations
Compensation:

USD 181,100-318,400 / year + Equity

Posted:
6+ months
Senior
Consumer Electronics
Consumer Products, Hardware
Hardware
Mobile Devices
Operating Systems
Wearables