IC Senior Packaging Engineer
NVIDIA
NVIDIA is seeking a Senior Package Engineer in Taiwan to drive the development of sophisticated IC substrates and ASIC packages for our networking products. In this role, you will represent the Networking Packaging organization, partnering with SI, package layout, and ASIC design teams, and collaborating closely with suppliers and Operations. You will provide technical leadership across the entire product lifecycle—from concept through NPI and ramp—driving DFM, manufacturing feedback, and process optimization to strengthen supply robustness and quality. Responsibilities include schedule planning and delivery management, cost and risk ownership, and hands-on resolution of packaging, manufacturing, and electrical design issues. The position is based in Taiwan and reports to NVIDIA Networking HQ in Israel (remote collaboration).
What you will be doing:
Leading development of cutting-edge microelectronics packaging of NVIDIA Networking Business Unit’s future products, evaluating NVIDIA products for reliability and performance.
Review manufacturability readiness at each milestone.
Work with world leading vendors to develop highly challenging packaging solutions.
Leading the development of groundbreaking microelectronics packaging for NVIDIA Networking Business Unit's future products
Collaborating with world-leading vendors to develop highly ambitious packaging solutions
Thriving in a dynamic and challenging environment
Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues and establish quality standards.
Monitor substrate and assembly production KPIs and collaborate with cross functional teams to define and monitor Yield Improvement Plans for continuous improvement and establish quality standards.
Lead process changes reviews, prepare and present data in Change Control Board meetings, lead technical reviews of product changes throughout the supply chain.
What we need to see:
BSc in Mechanical/Materials Engineering (or related field) or equivalent experience.
5+ years of relevant experience in semiconductor packaging across development and manufacturing; background at substrate manufacturing or assembly sites is a plus.
Basic design proficiency with 2D ArtiosCAD and 3D CAD (NX/SolidWorks/Creo).
DFM expertise; solid understanding of tooling design, manufacturing processes, material properties, and metrology tools.
Strong focus on quality, robustness, and manufacturability.
High self-learning and self-motivation; fosters continuous improvement with a proactive approach.
Leadership capability to drive cross-company, cross-functional projects across multiple locations.
Curious, creative problem solver; well organized and able to manage multiple priorities.
Strong English communication skills (verbal and written).
Ways to stand out of the crowd:
Background in engineering semiconductor manufacturing processes.
Experience in a manufacturing environment and with manufacturing statistics tools.
Hands-on mechanical FEA experience—ideally developing simulations in Ansys.
Proficiency with mechanical CAD (e.g., SolidWorks).
NPI leadership, including close collaboration with Operations on manufacturing and quality. Proven ability to manage multiple packaging projects in cross-functional settings and teams.
Join us at NVIDIA, an equal-opportunity employer that values diversity and inclusion. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status. We are dedicated to providing reasonable accommodations and adjustments to applicants with disabilities throughout the recruitment process. If you require accommodations, please let us know, and we will work with you to meet your needs.