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Showing 285 jobs
Amazon

Ops Engineer, MSP CX, Mechatronics & Sustainable Packaging, Customer Experience

Bellevue, WA, USA
5 days
Internet Services
5001+ employees
IPO
Mid-Senior Level
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about Ops Engineer, MSP CX, Mechatronics & Sustainable Packaging, Customer Experience at Amazon
Apple

Packaging Product Design Engineer

Cupertino, CA, USA
6 days
Consumer Products, Hardware
5001+ employees
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about Packaging Product Design Engineer at Apple
Amazon

Packaging Engineer II, Project Kuiper

Everett, WA, USA
6 days
Internet Services
5001+ employees
IPO
Mid-Senior Level
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about Packaging Engineer II, Project Kuiper at Amazon
NVIDIA

Senior Package Layout Engineer - Hardware

United States; California, USA; Oregon, USA; Washington, USA; Arizona, USA; Nevada, USA; Santa Clara, CA, USA; Remote

USD 132k-253k / year + Equity

1 day
Computer Hardware
Hardware
5001+ employees
Senior
Read more
about Senior Package Layout Engineer - Hardware at NVIDIA
NVIDIA

Senior Package Layout Engineer - Hardware

Hsinchu City, Taiwan 300
2 days
Computer Hardware
Hardware
5001+ employees
Senior
Read more
about Senior Package Layout Engineer - Hardware at NVIDIA
Apple

IC Package Design Engineer

Santa Clara, CA, USA
6 days
Consumer Products, Hardware
5001+ employees
Mid-Senior Level
Read more
about IC Package Design Engineer at Apple
NVIDIA

Senior Package Layout Engineer

Hsinchu City, Taiwan 300
12 days
Computer Hardware
Hardware
5001+ employees
Senior
Read more
about Senior Package Layout Engineer at NVIDIA
NVIDIA

IC Senior Packaging Engineer

Hsinchu City, Taiwan 300
21 days
Computer Hardware
Hardware
5001+ employees
Senior
Read more
about IC Senior Packaging Engineer at NVIDIA
Qualcomm

Advanced Package Diagnostics Engineer, Staff(Hsinchu)

Hsinchu City, Taiwan 300
23 days
Telecommunication
5001+ employees
IPO
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about Advanced Package Diagnostics Engineer, Staff(Hsinchu) at Qualcomm
Apple

Packaging Substrate Engineer

Santa Clara, CA, USA
1 month
Consumer Products, Hardware
5001+ employees
Mid-Senior Level
Read more
about Packaging Substrate Engineer at Apple
Apple

Packaging Substrate Engineer

Santa Clara, CA, USA
1 month
Consumer Products, Hardware
5001+ employees
Mid-Senior Level
Read more
about Packaging Substrate Engineer at Apple
The Walt Disney Company

Staff Data Engineer

California, USA

USD 166,800-223,600 / year + Equity

Today
Entertainment
Media
5001+ employees
IPO
Senior
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about Staff Data Engineer at The Walt Disney Company
Infosys

Senior Consultant-Senior Software Engineer

Singapore
Today
5001+ employees
IPO
Senior
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about Senior Consultant-Senior Software Engineer at Infosys
Bank of America

Software Engineer III - GMOT Futures

United States; Jersey City, NJ, USA; Remote
4 days
Banking
Finance
5001+ employees
IPO
Mid-Senior Level
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about Software Engineer III - GMOT Futures at Bank of America
Electronic Arts

Senior Machine Learning Engineer

Stockholm, Sweden
6 days
Entertainment
Media
5001+ employees
IPO
Senior
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about Senior Machine Learning Engineer at Electronic Arts
JPMorganChase

Software Engineer III - Python Full Stack Developer, Wealth Management

Hong Kong
8 days
Finance
5001+ employees
Senior
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about Software Engineer III - Python Full Stack Developer, Wealth Management at JPMorganChase
Los Alamos National Laboratory

Packaging R&D Engineer 1/2 (R&D Engineer 1/2)

Los Alamos, NM, USA

USD 94,500-154,600 / year

1 month
Research
5001+ employees
Associate
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about Packaging R&D Engineer 1/2 (R&D Engineer 1/2) at Los Alamos National Laboratory
NVIDIA

IC Packaging Engineer

Yokne'am Illit, Israel
1 month
Computer Hardware
Hardware
5001+ employees
Mid-Senior Level
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about IC Packaging Engineer at NVIDIA
JPMorganChase

Lead Data Scientist

Dublin, Ireland
12 days
Finance
5001+ employees
Director
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about Lead Data Scientist at JPMorganChase
Johns Hopkins University Applied Physics Laboratory

2026 PhD Graduate - Advanced Sensor Technology Development

Laurel, MD, USA

USD 102,500-227,500 / year

12 days
Defense & Space
Government and Military
5001+ employees
Entry Level
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about 2026 PhD Graduate - Advanced Sensor Technology Development at Johns Hopkins University Applied Physics Laboratory
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